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TW7131B HTC Block

Specifications

Product details
DiameterHTC
Length/
ThreadHTC-Snap Locking
Segment SizeDouble Arrow Segment
Number of Segments2
Working Height12 mm
ModelTW7131B
Grit#16 / #24 / #40 / #80 / #120 / #180
ApplicationMetal Bond Diamond Tool

TW7131B HTC Block

TW7131B HTC Block is a professional metal bond diamond grinding tool designed for HTC floor grinding machines. Featuring a double arrow diamond segment design, it provides fast cutting performance, high grinding efficiency and excellent wear resistance. Equipped with the HTC Snap Locking system, it enables quick installation and stable operation, making it suitable for concrete grinding, terrazzo preparation and natural stone floor processing.

Features

  • Double arrow diamond segments for fast and aggressive grinding
  • HTC Snap Locking system for quick installation and replacement
  • High grinding efficiency with stable cutting performance
  • Excellent wear resistance and long service life
  • Available in different grit and bond options
  • Suitable for wet and dry concrete floor grinding

Applications

Suitable for concrete floor grinding, terrazzo grinding, stone surface preparation, floor leveling, coating removal and industrial floor renovation.

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