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TW7131C HTC Block

Specifications

Product details
DiameterHTC
Length/
ThreadHTC-Snap Locking
Segment SizeDouble Bar Segment
Number of Segments2
Working Height12 mm
ModelTW7131C
Grit#16 / #24 / #40 / #80 / #120 / #180
ApplicationMetal Bond Diamond Tool

TW7131C HTC Block

TW7131C HTC Block is a professional metal bond diamond grinding tool designed for HTC floor grinding machines. Featuring a double bar diamond segment design, it provides stable grinding performance, efficient material removal and excellent wear resistance. Equipped with the HTC Snap Locking system, it allows fast installation and secure attachment, making it suitable for concrete grinding, terrazzo preparation and natural stone floor processing.

Features

  • Double bar diamond segments for stable and efficient grinding
  • HTC Snap Locking system for quick installation and replacement
  • Balanced cutting performance and long service life
  • Excellent wear resistance for professional floor grinding
  • Available in different grit and bond options
  • Suitable for wet and dry grinding applications

Applications

Suitable for concrete floor grinding, terrazzo grinding, stone surface preparation, floor leveling, coating removal and industrial floor renovation.

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