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TW7131D HTC Block

Specifications

Product details
DiameterHTC
Length/
ThreadHTC-Snap Locking
Segment SizeDouble Round Segment
Number of Segments2
Working Height12 mm
ModelTW7131D
Grit#16 / #24 / #40 / #80 / #120 / #180
ApplicationMetal Bond Diamond Tool

TW7131D HTC Block

TW7131D HTC Block is a professional metal bond diamond grinding tool designed for HTC floor grinding machines. Featuring a double round diamond segment design, it provides smooth cutting performance, stable grinding results and excellent wear resistance. Equipped with the HTC Snap Locking system, it allows quick installation and reliable operation, making it suitable for concrete floor grinding, terrazzo preparation and natural stone surface processing.

Features

  • Double round diamond segments for smooth and stable grinding
  • HTC Snap Locking system for fast installation and replacement
  • Balanced cutting performance with excellent tool life
  • High wear resistance for professional grinding applications
  • Available in different grit and bond options
  • Suitable for wet and dry floor grinding

Applications

Suitable for concrete floor grinding, terrazzo grinding, stone surface preparation, floor leveling, coating removal and industrial floor renovation.

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