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TW7131E HTC Block

Specifications

Product details
DiameterTW7131E
Length/
ThreadHTC-Snap Locking
Segment SizeArrow Segment
Number of Segments2
Working Height12 mm
ModelTW7131E
Grit#16 / #24 / #40 / #80 / #120 / #180
ApplicationMetal Bond Diamond Tool

TW7131E HTC Block

TW7131E HTC Block is a professional metal bond diamond grinding tool designed for HTC floor grinding machines. Featuring an arrow diamond segment design, it provides fast cutting performance, efficient material removal and stable grinding results. Equipped with the HTC Snap Locking system, it allows quick installation and reliable operation, making it suitable for concrete floor grinding, terrazzo preparation and natural stone surface processing.

Features

  • Arrow diamond segments for fast and efficient grinding
  • HTC Snap Locking system for quick installation and replacement
  • Excellent balance between cutting speed and tool life
  • Stable grinding performance with uniform wear
  • Available in different grit and bond options
  • Suitable for wet and dry floor grinding applications

Applications

Suitable for concrete floor grinding, terrazzo grinding, stone surface preparation, floor leveling, coating removal and industrial floor renovation.

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