Diamond Polishing Tools Supplier, Industry & Trade Integration, Diamond Saw Blade Manufacturer, Granite & Marble Tools
TW7131F HTC Block
Specifications
Product detailsDiameterHTC
Length/
ThreadHTC-Snap Locking
Segment SizeSingle Bar Segment
Number of Segments2
Working Height12 mm
ModelTW7131F
Grit#16 / #24 / #40 / #80 / #120 / #180
ApplicationMetal Bond Diamond Tool
W7131F HTC Block
TW7131F HTC Block is a professional metal bond diamond grinding tool designed for HTC floor grinding machines. Featuring a single bar diamond segment design, it provides higher grinding pressure, efficient material removal and stable cutting performance. Equipped with the HTC Snap Locking system, it allows quick installation and reliable operation, making it suitable for concrete grinding, terrazzo preparation and heavy-duty surface leveling.
Features
- Single bar diamond segments for increased grinding pressure
- HTC Snap Locking system for fast installation and replacement
- Efficient material removal with stable cutting performance
- Excellent wear resistance and long service life
- Available in different grit and bond options
- Suitable for heavy-duty concrete floor grinding
Applications
Suitable for concrete floor grinding, terrazzo grinding, stone surface preparation, floor leveling, coating removal and industrial floor renovation.
