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TW7231A Ø76 Other Segment Shape Plate

Specifications

Product details
DiameterØ76 mm
Length/
ThreadBack1
Segment SizeSpiral Segment
Number of Segments8
Working Height12 mm
ModelTW7231A
Grit#16 / #24 / #40 / #80 / #120 / #180
ApplicationMetal Bond Diamond Plate

TW7231A Ø76 Other Segment Shape Plate

TW7231A Ø76 Other Segment Shape Plate is a professional metal bond diamond grinding plate featuring an innovative spiral segment design. The spiral arrangement provides continuous cutting action, excellent debris removal and smooth grinding performance, making it ideal for concrete floor preparation, epoxy coating removal and terrazzo grinding. The Back1 mounting system ensures quick and secure installation on compatible floor grinding machines.

Features

  • Ø76 mm grinding plate with spiral diamond segments
  • Continuous cutting action for fast stock removal
  • Excellent dust and slurry discharge during grinding
  • Stable grinding performance with reduced vibration
  • High wear resistance and long service life
  • Available in multiple grit sizes and bond hardness options
  • Suitable for both wet and dry grinding applications

Applications

Suitable for concrete floor grinding, epoxy coating removal, terrazzo grinding, floor leveling, surface preparation and natural stone floor renovation.

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