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TW7232A Ø76 Other Segment Shape Plate

Specifications

Product details
DiameterØ76 mm
Length/
ThreadBack3
Segment Size3 Arrow Segments
Number of Segments3
Working Height12 mm
ModelTW7232A
Grit#16 / #24 / #40 / #80 / #120 / #180
ApplicationMetal Bond Diamond Plate

TW7232A Ø76 Other Segment Shape Plate

TW7232A Ø76 Other Segment Shape Plate is a professional metal bond diamond grinding plate designed with three arrow-shaped diamond segments. The aggressive arrow segment configuration delivers rapid stock removal, excellent grinding efficiency and superior cutting performance for concrete floor preparation. The Back3 mounting system provides secure installation on compatible floor grinding machines.

Features

  • Ø76 mm grinding plate with three arrow diamond segments
  • Aggressive cutting action for fast material removal
  • Excellent performance on hard concrete and coating removal
  • Stable grinding with reduced vibration
  • High wear resistance and long service life
  • Available in multiple grit sizes and bond hardness options
  • Suitable for both wet and dry grinding applications

Applications

Suitable for concrete floor grinding, epoxy coating removal, terrazzo grinding, floor leveling, surface preparation and natural stone floor renovation.

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