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TW7232C Ø76 Other Segment Shape Plate

Specifications

Product details
DiameterØ76 mm
Length/
Thread/
Segment SizeCross Arrow Segments
Number of Segments6
Working HeightBack5
ModelTW7232C
Grit#16 / #24 / #40 / #80 / #120 / #180
ApplicationMetal Bond Diamond Plate

TW7232C Ø76 Other Segment Shape Plate

TW7232C Ø76 Other Segment Shape Plate is a professional metal bond diamond grinding plate featuring six cross-arrow diamond segments. The optimized segment layout provides aggressive grinding performance, high stock removal efficiency and excellent stability, making it ideal for heavy-duty concrete floor preparation and coating removal. The Back5 mounting system ensures secure installation on compatible floor grinding machines.

Features

  • Ø76 mm grinding plate with six cross-arrow diamond segments
  • Large grinding contact area for higher productivity
  • Fast stock removal with stable cutting performance
  • Excellent wear resistance and extended service life
  • Reduced vibration for smoother grinding
  • Available in multiple grit sizes and bond hardness options
  • Suitable for wet and dry grinding applications

Applications

Suitable for concrete floor grinding, terrazzo grinding, epoxy coating removal, floor leveling, surface preparation and natural stone floor renovation.

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