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TW7233A Ø76 Other Segment Shape Plate

Specifications

Product details
DiameterØ76 mm
Length/
ThreadBack1
Segment SizeRectangle Segment
Number of Segments2
Working Height12 mm
ModelTW7233A
Grit#16 / #24 / #40 / #80 / #120 / #180
ApplicationMetal Bond Diamond Plate

TW7233A Ø76 Other Segment Shape Plate

TW7233A Ø76 Other Segment Shape Plate is a professional metal bond diamond grinding plate designed with two rectangular diamond segments. The optimized segment configuration provides stable grinding performance, efficient material removal and excellent durability. It is suitable for concrete floor grinding, epoxy coating removal, terrazzo grinding and various floor surface preparation applications.

Features

  • Ø76 mm grinding plate with two rectangular diamond segments
  • Stable cutting performance with excellent grinding balance
  • Efficient material removal for concrete floor preparation
  • High wear resistance and long service life
  • Available in multiple grit sizes and bond hardness options
  • Suitable for wet and dry grinding applications

Applications

Suitable for concrete floor grinding, terrazzo grinding, epoxy removal, floor leveling, surface preparation and natural stone floor renovation.

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